A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures

📝 Original Info

• Title: A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures
• ArXiv ID: 2511.09348
• Date: 2025-11-12
• Authors: ** Yanpeng Gong, (공동 저자들) – 정확한 공동 저자 명단은 원문을 참고하시기 바랍니다. **

📝 Abstract

This study presents a finite element and virtual element (FE-VE) coupled method for thermomechanical analysis in electronic packaging structures. The approach partitions computational domains strategically, employing FEM for regular geometries to maximize computational efficiency and VEM for complex shapes to enhance geometric flexibility. Interface compatibility is maintained through coincident nodal correspondence, ensuring solution continuity across domain boundaries while reducing meshing complexity and computational overhead. Validation through electronic packaging applications demonstrates reasonable agreement with reference solutions and acceptable convergence characteristics across varying mesh densities. The method effectively captures thermal distributions and stress concentrations in multi-material systems, establishing a practical computational framework for electronic packaging analysis involving complex geometries. Source codes are available at https://github.com/yanpeng-gong/FeVeCoupled-ElectronicPackaging.

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